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Eutectic bonding equipment introduction

MRSI-HVM Eutectic Equipment

 

The MRSI-HVM product series is recognized as the industry's outstanding chip mounter for its leading speed, "zero time" switching between nozzles and less than 1.5 micron placement accuracy. Its dual heads, dual eutectic soldering stations, "zero time" nozzle switching system configuration, ultra-fast eutectic soldering temperature rise and fall, and multi-level multi-function parallel process automation processing have achieved outstanding performance in the optical module product series. 

Advantages of the MRSI-HVM Series

 

• Dual head, dual eutectic soldering stations
• Zero time nozzle switching system
• Ultra-fast eutectic soldering temperature rise and fall
• Designed for specific applications, including COC, COS, COB assembly of eutectic and epoxy chip mount

Eutectic Bonding Process

 

• Precise control of device temperature
• Precise control of contact force
• Oxide removal by scrubbing
• Controlled cooling and mounting
• Inert atmosphere with cover gas or flux with cover gas

Production Performance

 

• Placement accuracy: <1.5 um
• Placement repeatability: ≤ 1µm
• Excellent speed, zero-time nozzle change
• Equipped with inline conveyor for single fixture or multiple cassette input

Value to Customers

 

• Industry-leading throughput, exceptional flexibility, and ultra-high precision in high-mix manufacturing
• Easy-to-use graphical interface running on a platform for easy programming and low-cost machine maintenance