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Hardware Engineer

Job Responsibilities:
1. Responsible for defining and writing optical module specifications according to market and customer requirements; 
2. Responsible for implementing optical module system design, defining main performance parameters and refining requirements of each part; according to the principle of "design for mass production", interact with other engineers, select key components, define specific interfaces, and complete module design; 
3. Responsible for the overall circuit principle design, circuit analysis and simulation of optical modules, and implement or supervise PCB wiring design; interact with RF engineers to ensure signal consistency; work with test engineers to determine test methods and details to ensure that the module meets industry and customer requirements; 4. 
Responsible for completing various performance index tests and reliability tests of optical modules; 
5. Responsible for interacting with key IC manufacturers to discuss and determine technical indicators; 
6. Responsible for evaluating the risks of product design and various parts, and implementing simulation or experiments on key elements to verify and make risks controllable; responsible for product cost analysis and management to meet market and customer requirements; 
7. Responsible for the generation and management of technical documents required for research and development; 
8. Responsible for research on cutting-edge technology trends, actively make suggestions to the team, accept and review suggestions from others, actively innovate and apply for patents; 
9. Responsible for organizing and leading optical module projects, technical support market, customers, NPI and production lines.


Job Requirements: 
1. Bachelor degree or above, major in microelectronics, optical communication, more than three years of experience in optical communication network and high-speed optical module design; 
2. Familiar with the operation of the optical communication physical layer, proficient in the principles of optical devices, know the working principles of MZ modulator and EAM modulator, understand link damage, and be able to estimate link power, 
optical signal-to-noise ratio, etc.; 3. Experience in developing NRZ/PAM4 modulation methods, familiar with direct modulation and external modulation methods, know digital signal processors (DSP) and PHY chips for optical modules, understand the principles of linear drivers/transimpedance amplifiers/clock recoveries, and understand the structure and principles of current and next-generation optical modules; 
4. Have strong English writing and oral communication skills, and have a team spirit of actively cooperating with others; 5. 
Those with experience in 400G and above optical module design, and those with silicon photonics design experience are preferred.

If you wish to apply for this position, please send your resume to the HR mailbox:jy.zhou@sz-hiragawa.com
Or call HR to learn more:15737196796

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